METHOD AND MEANS FOR CONNECTING THIN METAL LAYERS

 

Abstract

This is an innovative method for bonding two thin metal layers applied to flexible substrates. This connection is achieved by micro (hollow) rivets, providing a mechanical and electrical link through the use of modern laser technology. Previous attachment procedures such as welding, soldering or the use of adhesives carry many disadvantages and require certain material properties that are unfeasible with flexible surfaces. This method is reliable and doesn’t require large contact areas, effortlessly providing a mechanical and electrical bond.

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Learn more by contacting Mr. Paris Rallis at This email address is being protected from spambots. You need JavaScript enabled to view it. .
 

Funding Opportunities

Available funding opportunities:

EIC Accelerator
EIC Pathfinder

EIC Transition

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